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• Features & Benefits
• Subfloor Preparation
• Priming
• Mixing
• Application
• Substrates

Features & Benefits

• Specifically designed for use over a wide variety of subfloors including:
  • Concrete
  • Sand & cement
  • Calcium sulphate/anhydrite/hemihydrate screeds
  • Existing cementitious underlayments
  • Damp proof membranes
  • Surface electrical radiant heating systems
  • Flooring grade plywood
  • Rigid steel
  • Flooring grade asphalt
  • Porcelain, ceramic, quarry or terrazzo floors
  • Moisture tolerant adhesive residues
• Foot traffic in as little as 90 minutes
• Ready to receive bonded floor coverings after 4 hours
• Use over most common subfloors, including old adhesive residues
• UFH compatible
• Low odour 
• Protein free formulation means it is ideal for use in biologically sensitive areas
• Moisture tolerant formulation makes it suitable for the pre-smoothing of floors prior to the application of surface damp proof membranes (DPM) and moisture vapour suppressants (MVS)
• Due to its excellent adhesion characteristics it can be used on most common substrates without the need to prime

Subfloor Preparation

• All surfaces must be dry and in a sound and stable condition free from contaminants that may prevent adhesion such as dust, oils, grease, surface laitance, water soluble adhesive residues and weak smoothing underlayments etc.
• Smooth dense surfaces can be roughened by mechanical scabbling to enhance the key
• Subfloors should be tested in accordance with BS8203 to ensure a moisture reading of less than 75% RH is achieved
• Where this has not been attained or where there is uncertainty that the subfloor design incorporates a Damp Proof Course (DPC) then UltraFloor DPM IT or UltraFloor Suppress IT must be applied (see relevant UltraFloor product technical datasheet)
• All substrates must be at a minimum temperature of 5°C before, during and after application of the primer to ensure film forming and bonding is achieved

Priming

Absorbent Subfloors (concrete, sand & cement, plywood etc): Priming is not required for the purpose of adhesion.

NOTE: To ensure a pinhole free surface is attained priming can be carried out using UltraFloor Prime IT Multi-surface Primer (MSP), where this is not important such as applications of textiles or loose lay laminate flooring, priming may be omitted. Subfloors must be sound, stable, free from dust, grease and all debris. Any remaining residues should be firmly bonded, hard and not soluble to water. Specific priming requirements are needed for calcium sulphate/anhydrite/hemihydrate screeds (see Substrate section - Calcium Sulphate/Anhydrite/Hemihydrate Screeds).

Non-absorbent Subfloors (epoxy resin damp proof membranes, moisture tolerant adhesive residues, flooring grade asphalt, porcelain, ceramic, quarry and terrazzo floors, steel mezzanine decks, access panels etc): Priming is not required for the purpose of adhesion, it is also not required with applications to UltraFloor DPM IT or UltraFloor Suppress IT as long as UltraFloor Level IT Bond is applied within 12 hours of application and it is traffickable.

Mixing

• Shake the pre-gauged bottle of liquid prior to opening
• Pour the entire contents of the liquid into an oversized bucket (20 litres or more capacity)
• Gradually add the powder whilst continually mixing using an electric drill fitted with a power whisk, suitable for use with cement materials
• After completely adding the powder, continue mixing for a further 2 minutes, keeping the whisk below the surface of the product to minimise air entrainment, until a lump free creamy material is attained
• UltraFloor Level IT Bond should only be mixed as single units
• Do not add further liquid or water

Application

• Pour onto the floor and spread with a smooth edge steel trowel
• UltraFloor Level IT Bond has exceptional flow characteristics, a spiked roller may be used to further improve the finish particularly between adjacent units of product
• Only spike roll whilst the product is still in its fluid state, typically up to 10 minutes after application
• All curing and drying times are based on good site conditions i.e. an air temperature of 20oC, air humidity of 65% RH and good ventilation
• Sites that are cold, humid or damp or in areas where the airflow is poor, will prolong drying and curing times, so allowances should be made accordingly
• Applications to non-absorbent substrates and at thicker application depths will take longer to dry

NOTE: Avoid strong drafts and direct sunlight during curing. UltraFloor Level IT Bond is ready to receive light foot trafficking normally after 90 to 120 minutes, based on 3mm thick application. Floor coverings can be bonded in as little as 4 hours.

Coverage Rates:

Substrates

Calcium Sulphate/Anhydrite/Hemihydrate Screeds: Mechanically remove any laitance and provide a sound, clean, dry and dust-free surface. The relative humidity within the subfloor must read below 75% RH prior to the application of a barrier primer (damp proof membranes and moisture vapour suppressants are not recommended). These types of screeds often incorporate warm water underfloor heating systems (see relevant manufacturers’ technical datasheet) which can be used, along with dehumidifiers, to speed up the drying process. Manufacturers normally suggest this can be conducted after 7 days minimum curing. Apply UltraFloor Prime IT MSP diluted 3:1 with clean water and allow to fully dry overnight. Apply a second coat diluted 1:1 with clean water allowing it to dry to a pink film (usually 1-2 hours).

Flooring Grade Asphalt: New asphalt must be left for a minimum of 7 days and degreased to remove surface bloom. Existing asphalt should be assessed for cracks. If cracks are present they need to be repaired to give a continuous strong subfloor. The use of epoxy resins bulked out with sand is normally sufficient.

Non-flexing Steel Floors (e.g. mezzanine decks): Mechanically abrade using a suitable mechanical machine (STG or shot blast)) or a wire brush to give an abraded shiny corrosion free surface and remove all excess traces of metal.

Flooring Grade Plywood: UltraFloor Level IT Bond is suitable for use over many plywood substrates provided the plywood is mechanically fixed and of suitable thickness. Normally plywood that has been in-situ for many years will be stable and suitable for application. Newly installed flooring grade plywood (e.g. SP101) must be mechanically fixed to a sound strong base.

Patching prior to Plywood Overlays: Sound stable subfloors including T and G floor boards that are to be overlayed with flooring grade plywood may first be smoothed or patch filled with UltraFloor Level IT Bond.

Pre-smoothing of Subfloors: Where there is an absence of a DPC pre-smoothing can be carried out provided there is no risk of hydrostatic pressure and all previous materials have been removed to leave the cementitious base. If in any doubt, please apply UltraFloor DPM IT (see relevant UltraFloor product technical datasheet) directly to the original subfloor. Pre-smoothing is not suitable over old adhesive residues.

Surface DPM and MVS: These are considered as non-absorbent substrates. Applications should be carried out within 12 hours of UltraFloor DPM IT and/or UltraFloor Suppress IT application (see relevant UltraFloor product technical datasheets).

Radiant Electrical Underfloor Heating Systems: Cables must be secured to a sound strong mechanically fixed cement faced backer board. It may also be used where electrical underfloor heating is used over cementitious or calcium sulphate subfloors (see calcium sulphate screed section). In all cases UltraFloor Level IT Bond must be applied at a thickness of 5mm above the cables for resilient, textile and timber applications and a minimum of 3mm for application of stone, ceramic or porcelain products.